High-performance, high-bandwidth, high-capacity solutions help bring virtual reality closer to real reality. To meet the growing market demand, Samsung has developed GDDR6W (x64) graphics memory. This is the industry’s first next-generation DRAM technology.
GDDR6W is based on GDDR6 (x32) by introducing Fan-Out Wafer-Level Packaging (FOWLP) technology, which greatly increases memory bandwidth and capacity. Last July, Samsung introduced the industry’s fastest 24Gbps GDDR6 graphics memory. GDDR6W doubles this figure while maintaining the same dimensions. This allows new memory chips to be easily implemented in the same production processes that used GDDR6.
FOWLP technology involves mounting the memory chip directly on a silicon wafer rather than on a printed circuit board. In addition, the absence of a printed circuit board reduces the thickness of the substrate and improves heat dissipation. The height of the GDDR6W chip is 0.7 mm, which is 36% less than that of GDDR6. Reduced production time and costs because there is no need to increase the size of the board – you can fit twice as many memory chips in the same area. Chip capacity increases from 16 to 32 GB, throughput – up to 1.4 TB / s, transfer rate – up to 22 Gb / s per contact.
Samsung noted that with GDDR6W, it is possible to promote differentiated memory products that can meet different customer needs. The company intends to expand the use of GDDR6W to small form factor devices, which include laptops, as well as high-end graphics accelerators used for high-performance computing.